Effects of gate shaping and consequent process changes on AlGaN/GaN HEMT reliability
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چکیده
منابع مشابه
Design of X Band High Power Amplifier MMIC Based on AlGaN/GaN HEMT
In this paper, we have presented an X band high power amplifier based on MMIC (Monolithic Microwave Integrated Circuit) technology for satellite remote sensing systems. We have used GaN HEMT process with 500 nm gate length technology with VD= 40 V and VG= -2 V in class E structure. The proposed two-stage power amplifier provides 25 dB power gain with maximum output power of 49.3 dBm at 10 GHz. ...
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0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.033 ⇑ Corresponding author. Tel.: +91 11 24115580; fax E-mail addresses: [email protected] ( (R.S. Gupta). 1 Tel.: +91 11 24115580; fax: +91 11 24110606. In the work proposed, linearity performance of dual material gate (DMG) AlGaN/GaN HEMT has been analyzed and compared with the corresponding performance o...
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The effects of strain relaxation of AlGaN barrier layer on the conduction band profile, electron concentration and two-dimensional gas (2DEG) sheet charge density in a high Al-content AlGaN/GaN high electron mobility transistor (HEMT) are calculated by self-consistently solving Poisson’s and Schrödinger’s equations. The effect of strain relaxation on dc I-V characteristics of AlxGa1−xN/GaN HEMT...
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